Diamond Series
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Applications:Industrial Manufacturing, Superhard Materials
The Diamond series solid-state laser source is specially designed for cutting, drilling, etching and other precision machining needs of carbon and ultra-hard materials such as diamond, SiC, carbon fibre, etc. They solve the problem that traditional fibre and solid-state lasers cannot achieve an etching depth of more than 3mm on ultra-hard materials due to low energy.
Diamond series lasers have high single pulse energy, which makes them able to etch and process deeper on super-hard materials, breaking through the limitations of traditional lasers that can only be processed to a certain depth and then can not continue to extend downwards. This excellent processing capability makes it more efficient in processing ultra-hard materials.
In addition, Diamond series lasers also provide various pulse width options, which offer various possible process options for the processing of ultra-hard materials and can be flexibly selected and adjusted according to different material characteristics and processing needs, further improving processing efficiency and quality.
Laser Products
Product | Model | Average Power (W) | Single Pulse Energy (uJ) | Repitition Rate | Pulse Width (ns) | Application | Learn more |
355nm mini laser | MMEPU-D-355-1 | >1W@20KHZ | ~50uJ@20KHZ | Uncontrollable range 15-20KHZ | ~7ns@20KHZ | Diamond girdle marking, electronic products marking | Click Here |
355nm high-energy 30ns lasers | MMEPU-355-10-HE-D30 | >10W@10kHz | ~1000uJ@10kHz | 10kHz-100kHZ | <30ns@10kHz | Diamond cutting – slicing and coring, Super hard materials cutting – PcBN, PCD, SCD and CVD diamond, SiC, etc. | Click Here |
MMEPG-532-16-HE-D30 | >16W@10kHz | ~1600uJ@10kHz | 7kHz-100kHZ | <30ns@10kHz | Diamond slicing&coring Diamond shape cutting(4 Processing for 4mm+ diamonds) Carbon fiber cutting Sic wafer dicing | Click Here | |
MMEPG-532-20-HE-D30 | >20W@10kHz | ~2000uJ@10kHz | 7kHz-100kHZ | ||||
MMEPG-532-16-HE-D70 | >16W@10kHz | ~1600uJ@10kHz | 7kHz-100kHZ | >70ns@10kHz | Click Here | ||
MMEPG-532-20-HE-D70 | >20W@10kHz | ~2000uJ@10kHz | 7kHz-100kHZ | ||||
MMEPA-1064-18-HE-D30 | >18W@10kHz | ~1800uJ@10kHz | 7kHz-100kHz | <30ns@10kHz | Drilling in brittle materials, Carbon material cutting, Laser trimming | Click Here | |
MMEPA-1064-25-HE-D30 | >25W@10kHz | ~2500uJ@10KHZ | 7kHz-100kHz | ||||
1064nm high-energy 70ns lasers | MMEPA-1064-18-HE-D70 | >18W@10kHz | ~1800uJ@10kHz | 7kHz-100kHZ | >70ns@10kHz | Click Here | |
MMEPA-1064-25-HE-D70 | >25W@10kHz | ~2500uJ@10KHZ | 7kHz-100kHZ | ||||
1064nm gem planning laser | MMD-YAG-1064-1 | >1W@12kHz | ~30uJ@12kHz | ~12kHz | ~12ns@12kHz | Gem planning Diamond marking | Click Here |