Diamond Series

Diamond series

Applications:Industrial Manufacturing, Superhard Materials

The Diamond series solid-state laser source is specially designed for cutting, drilling, etching and other precision machining needs of carbon and ultra-hard materials such as diamond, SiC, carbon fibre, etc. They solve the problem that traditional fibre and solid-state lasers cannot achieve an etching depth of more than 3mm on ultra-hard materials due to low energy.

Diamond series lasers have high single pulse energy, which makes them able to etch and process deeper on super-hard materials, breaking through the limitations of traditional lasers that can only be processed to a certain depth and then can not continue to extend downwards. This excellent processing capability makes it more efficient in processing ultra-hard materials.

In addition, Diamond series lasers also provide various pulse width options, which offer various possible process options for the processing of ultra-hard materials and can be flexibly selected and adjusted according to different material characteristics and processing needs, further improving processing efficiency and quality.

Laser Products

ProductModelAverage Power (W)Single Pulse Energy (uJ)Repitition RatePulse Width (ns)ApplicationLearn more

355nm

MMEPU-D-355-1>1W@20KHZ~50uJ@20KHZUncontrollable
range 15-20KHZ
~7ns@20KHZDiamond waistline marking,
electronic products marking
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                        355nm     

MMEPU-355-10-HE-D30>10W@10kHz~1000uJ@10kHz10kHz-100kHZ<30ns@10kHzDiamond cutting – slicing and coring, Super hard materials cutting – PcBN,
PCD, SCD and CVD diamond, SiC, etc.
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                    532nm

MMEPG-532-16-HE-D30>16W@10kHz~1600uJ@10kHz7kHz-100kHZ<30ns@10kHzDiamond slicing&coring
Diamond shape cutting(4 Processing for 4mm+ diamonds)
Carbon fiber cutting
Sic wafer dicing
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MMEPG-532-20-HE-D30>20W@10kHz~2000uJ@10kHz7kHz-100kHZ

                      532nm

MMEPG-532-16-HE-D70>16W@10kHz~1600uJ@10kHz7kHz-100kHZ>70ns@10kHzClick Here
MMEPG-532-20-HE-D70>20W@10kHz~2000uJ@10kHz7kHz-100kHZ

                   1064nm

MMEPA-1064-18-HE-D30>18W@10kHz~1800uJ@10kHz7kHz-100kHz<30ns@10kHzDrilling in brittle materials, Carbon material cutting, Laser trimmingClick Here
MMEPA-1064-25-HE-D30>25W@10kHz~2500uJ@10KHZ7kHz-100kHz

              1064nm

MMEPA-1064-18-HE-D70>18W@10kHz~1800uJ@10kHz7kHz-100kHZ>70ns@10kHzClick Here
MMEPA-1064-25-HE-D70>25W@10kHz~2500uJ@10KHZ7kHz-100kHZ

1064nm

MMD-YAG-1064-1>1W@12kHz~30uJ@12kHz~12kHz~12ns@12kHzGem planning
Diamond marking
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