Applications：Industrial Manufacturing, Superhard Materials
The Diamond series solid state lasers are specially designed for cutting, drilling, etching and other precision machining needs of carbon and ultra-hard materials such as diamond, SiC, carbon fiber and so on. They solve the problem that traditional fibre lasers and solid state lasers are difficult to achieve an etching depth of more than 3mm on ultra-hard materials due to their low energy.
Diamond series lasers have high single pulse energy, which makes it able to etch and process deeper on super-hard materials, breaking through the limitations of traditional lasers that can only be processed to a certain depth and then can not continue to extend downwards. This greater processing capability makes it more efficient in processing ultra-hard materials.
In addition, Diamond series lasers also provide a variety of pulse width options, which provides a variety of possible process options for the processing of ultra-hard materials, and can be flexibly selected and adjusted according to different material characteristics and processing needs, further improving processing efficiency and quality.
|Product||Model||Average Power (W)||Single Pulse Energy (uJ)||Repitition Rate||Pulse Width (ns)||Application||Learn more|
|~7ns@20KHZ||Diamond waistline marking,|
electronic products marking
|MMEPU-355-10-HE-D30||>10W@10kHz||~1000uJ@10kHz||10kHz-100kHZ||<30ns@10kHz||Diamond cutting – slicing and coring, Super hard materials cutting – PcBN,|
PCD, SCD and CVD diamond, SiC, etc.
Diamond shape cutting(4 Processing for 4mm+ diamonds)
Carbon fiber cutting
Sic wafer dicing
|1064nm||MMEPG-1064-18-HE-D30||>18W@10kHz||~1800uJ@10kHz||7kHz-100kHz||<30ns@10kHz||Drilling in brittle materials, Carbon material cutting, Laser trimming||Click Here|