Model No. | MMEPA-1064-25-HE-D20 |
Optical Characteristics | |
Wavelength (nm) | 1064nm |
Average Power (W) | >25W@10kHz |
Single Pulse Energy (uJ) | ~2500uJ@10kHz |
Pulse Width (ns) | ~20ns@10kHz |
Repitition Rate | 7kHz-100kHZ |
Pulse Stability | <3% rms |
Long Term Stability | <±3% |
Beam Characteristics | |
Polarization Ratio | Horizontal;>100:1 |
Beam Diameter | ~1mm(at exit) |
Beam Circularity | >90% |
Spatial Mode | TEM00, M²<1.3 |
Operating Specifications | |
Warm-up Time | <15 minutes from cold start |
Electrical Requirement | DC17.5V,350W |
Ambient Temperature | 10-35℃,RH<80% |
Storage Conditions | -10-40℃,RH<90% |
Physical Characteristics | |
Cooling System | Water-Cooled |
Water Temperature (laser inlet) | 25℃ |
MMEPA-1064-25-HE-D20
Higher peak power of the laser enables greater processing capability and efficiency, particularly in cutting ultra-hard materials like silicon carbide and diamond. The laser system is highly integrated, incorporating the laser, power supply, Q-switching control, and protection circuits into a compact and easy-to-install unit, facilitating maintenance. The internal resonator cavity is equipped with a self-cleaning system and stable cavity design, addressing power attenuation issues and ensuring an extended lifespan.
Features:
Single pulse energy>2.5mj
Superior beam quality M²<1.3
Ultra-long service life and power stability
All-in-one compact design
Application:
Diamond slicing&coring
Diamond shape cutting(4P processing for 4mm+diamonds)
Carbon fiber cutting
Sic wafer dicing
Super hard material cutting