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#
  • Home
  • Products

    Elite Series

    Silicon carbide wafer scribin, Carbon Fibre Cutting, Silicon wafer scribing.

    Diamond Series

    Diamond slicing, coring, sawing, planing Super hard material cutting - PcBN, PCD, SCD and CVD diamond, SiC, etc.

    Stone Series

    Material marking - plastic, glass, metal molds, wood, packaging bags, jade, etc. Crystal internal engraving, PCB&FPC marking, 3C product surface marking.

  • Technology
    • High Power, High Performance UV Laser Technology
    • Ultrafast Laser Technology Based on Microchip Chirp Amplification
    • Solid State MOPA Amplification and Nonlinear Frequency Conversion Technology
    • Intellectual Property
  • Applications
    • Semiconductor & Energy
    • Consumer Electronics & Appliances
    • Diamond & Jewelry
    • Automotive & Aerospace
    • Toolmaking
    • Packaging
    • Medical
    • 3D printing/additive manufacturing
  • Service
    • Customer support
    • Resource download
    • Solutions
  • About Us
    • Company Profile
    • Development history
    • Technical team
    • Pateners
  • News & Blog
    • Blog
    • News
  • Contact Us
    • Join us
    • Distributorship
July 28, 2021 / By 6086

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  • Blackened Aluminum,Choose Maiman End Pump Laser, Low Cost and Stable November 24, 2023
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  • Maiman laser invites you to participate in the South China Optoelectronics Exhibition October 25, 2023
  • Application of end-pumped lasers in marking non-metallic parts in the automotive field May 8, 2023
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