Elite Series

Elite series Lasers

Applications: Industrial Manufacturing, Semiconductors

Maiman laser has a proven track record in semiconductor processing. They offer excellent power stability for long-term operation and excellent beam quality for efficient and accurate laser beams focusing on the target material, resulting in higher processing accuracy and efficiency. In addition, our lasers also have high single pulse energy, which can produce higher energy density quickly, thus better handling hard materials such as silicon carbide. These advantages have enabled our lasers to be widely used in scribing, drilling and cutting silicon carbide wafers, effectively solving the challenges of processing complex silicon carbide materials and providing customers with more efficient and accurate processing solutions.


ProductModelsAverage Power (W)Single Pulse Energy (uJ)Repetition RatePulse Width (ns)ApplicationsLearn More



MMEPU-355-15>15W@10kHz~1500uJ@60kHz10kHz-20kHz30ns@60kHzSic, Diamond Wafer Scribing,
Drilling and Cutting of Wafers,
Ceramic scribing and drilling.
Click Here

MMEPU-355-18>18W@50kHz~350uJ@50kHz50kHz-500kHz12ns@50kHzSolar Cell Scribing, PCB&FPC Slitting & Cutting, Silicon Wafer Scribing, Thin Film Cutting.Click Here

MMEPG-532-30>30W@60kHz~500uJ@60kHz50kHz-500kHz20ns@60kHzWafer annealing, Silicon Wafer Scribing, Wafer drilling and dicingClick Here