Applications: Industrial Manufacturing, Semiconductors
Maiman lasers have a proven track record in semiconductor processing. They offer excellent power stability for long term operation and excellent beam quality for efficient and accurate focusing of the laser beam on the target material, resulting in higher processing accuracy and efficiency. In addition, our lasers also have high single pulse energy, which can produce higher energy density in a short period of time, thus better handling hard materials such as silicon carbide. These advantages have enabled our lasers to be widely used in scribing, drilling and cutting silicon carbide wafers, effectively solving the challenges of processing difficult silicon carbide materials and providing customers with more efficient and accurate processing solutions.
|Product||Models||Average Power (W)||Single Pulse Energy (uJ)||Repitition Rate||Pulse Width (ns)||Applications||Learn More|
|MMEPU-355-18||>18W@50kHz||~350uJ@50kHz||50kHz-500kHz||12ns@50kHz||Solar Cell Scribing,PCB&FPC Slitting & Cutting,Silicon Wafer Scribing, Thin Film Cutting.||Click Here|
|MMEPG-532-30||>30W@60kHz||~500uJ@60kHz||50kHz-500kHz||20ns@60kHz||Wafer annealing,Silicon Wafer Scribing, Wafer drilling and dicing||Click Here|