Silicon carbide wafer scribin, Carbon Fibre Cutting, Silicon wafer scribing.
Diamond slicing, coring, sawing, planing
Super hard material cutting - PcBN, PCD, SCD and CVD diamond, SiC, etc.
Material marking - plastic, glass, metal molds, wood, packaging bags, jade, etc.
Crystal internal engraving, PCB&FPC marking, 3C product surface marking.
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