Silicon carbide wafer scribin, Carbon Fibre Cutting, Silicon wafer scribing.
Diamond slicing, coring, sawing, planing Super hard material cutting - PcBN, PCD, SCD and CVD diamond, SiC, etc.
Material marking - plastic, glass, metal molds, wood, packaging bags, jade, etc. Crystal internal engraving, PCB&FPC marking, 3C product surface marking.
