The high-energy ultraviolet laser, characterized by a wavelength of 355nm, features a single-pulse energy of 1.5mJ and a high peak power.

It efficiently cuts SiC and diamond wafers, directly severing the wafers and metal layers with high efficiency and a minimal edge breakage

(<2um).

Features:

• The laser power is 18-30W;
• Adopt UV-clean patented technology to solve power attenuation worry free used;
• The service life exceeds 20000 hours, maintenance is free, and no need for regular commissioningor calibration;
• Excellent beam quality M² < 1.3, simple process, and higher efficiency;
• 3-layer protection, protection grade IP65, more suitable for harsh working environment;
• Rugged, easy to install, and easy to integrate.

Application:

• Sic, diamond wafer dicing
• Drilling and cutting of wafers
• Ceramic scribing and drilling